A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints

Author:

Li Che-Yu,Subrahmanyan R.,Wilcox J. R.,Stone D.

Publisher

Springer US

Reference39 articles.

1. Homa, T. R., “Cracking of Electronic Packaging Joints due to Creep-Fatigue,” in Proc. of ASM 3d Conf. on Electronic Packaging: Materials and Processes and Corrosion in Microelectronics,Minneapolis, MN, ASM, 1987, pp. 209–216.

2. Raman, V., and T. C. Reiley, “Cavitation and Cracking in As-Cast and Superplastic Pb-Sn Eutectic during High-Temperature Fatigue,”Journal of Materials Science Letters 6(5)1987, pp. 549–551.

3. Agarwala, B. N., “Thermal Fatigue Damage in Pb-In Solder Interconnections,” in 23rd Annual Proc. Int. Reliability Physics Society, Orlando, Florida: IEEE, 1985, pp. 198–205.

4. Inoue, H., Y. Kurihara, and H. Hachino, “Pb-Sn Solder for Die Bonding of Silicon Chips,” IEEE Transactions on Components, Hybrids and Manufacturing Technology CHMT-9(2), 1986, pp. 190–194.

5. Subrahmanyan, R., J. R. Wilcox, and C.-Y. Li, “A Damage Integral Approach to Thermal Fatigue of Solder Joints,” IEEE Transactions on Components Hybrids and Manufacturing Technology CHMT-12(4),1989, pp. 480–491.

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4. An Empirical Crack Propagation Model and its Applications for Solder Joints;Journal of Electronic Packaging;1996-06-01

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