1. Subrahmanyan, R., Wilcox, J. R., and Li, C.-Y., “A Damage Integral Approach to Solder Joint Fatigue,” Microelectronic Packaging Technology: Materials and Processes, 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, PA, 1989, proceedings pp. 213–221.
2. Subrahmanyan
R.
, WilcoxJ. R., and LiC.-Y., “A Damage Integral Approach to Thermal Fatigue of Solder Joints,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, Dec. 1989, pp. 480–491.
3. Kenyon, J. L., Webster, G. A., Radon, J. C., and Turner, C. E., “An Investigation of the Application of Fracture Mechanics to Creep Cracking,” Creep and Fatigue in Elevated Temperature Applications, Inst. Mech. Eng., 1974, pp. 156.1–8.
4. Tomkins
B.
, “Fatigue Crack Propagation—An Analysis,” Philosophical Magazine, Vol. 18, 1968, pp. 1041–1066.
5. Korhonen, M. A., Liu, T., and Li, C.-Y., “Isothermal Fatigue Crack Growth in Flip Chip Solder Joints,” Application of Fracture Mechanics in Electronic Packaging and Materials, 1995 ASME International Mechanical Engineering Congress and Exhibition, EEP-Vol. 11/MD-Vol. 64, pp. 231–236.