The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Author:

Rzepka S.1,Korhonen M. A.2,Meusel E.3,Li C.-Y.2

Affiliation:

1. Technische Universitaet Dresden, Institut fuer Halbleiter-und Mikrosystemtechnik, D-01062 Dresden, Germany

2. Cornell University, Department of Materials Science and Engineering, Ithaca, NY 14853

3. Dresden University of Technology, Department of Electrical Engineering, D-01062 Dresden, Germany

Abstract

The stresses occurring in the solder joints during thermal loads have been studied by finite element analysis. Besides the cases of no underfill and perfect adhesion, underfill delaminations at the interfaces to the solder, to the chip, and to the substrate surfaces, respectively, have been considered. The simulation results indicate that rapid failing of the flip-chip modules due to delamination can be prevented effectively by using an underfill that has a high Young’s modulus at room temperature (even 20 GPa are not too high) and a CTE slightly lower than solder. Since the ultimate failure is always caused by growing of a major crack, the damage integral concept is valid for lifetime estimations even in the case of FC modules with underfill.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Subrahmanyan, R., Wilcox, J. R., and Li, C.-Y., “A Damage Integral Approach to Solder Joint Fatigue,” Microelectronic Packaging Technology: Materials and Processes, 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, PA, 1989, proceedings pp. 213–221.

2. Subrahmanyan R. , WilcoxJ. R., and LiC.-Y., “A Damage Integral Approach to Thermal Fatigue of Solder Joints,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, Dec. 1989, pp. 480–491.

3. Kenyon, J. L., Webster, G. A., Radon, J. C., and Turner, C. E., “An Investigation of the Application of Fracture Mechanics to Creep Cracking,” Creep and Fatigue in Elevated Temperature Applications, Inst. Mech. Eng., 1974, pp. 156.1–8.

4. Tomkins B. , “Fatigue Crack Propagation—An Analysis,” Philosophical Magazine, Vol. 18, 1968, pp. 1041–1066.

5. Korhonen, M. A., Liu, T., and Li, C.-Y., “Isothermal Fatigue Crack Growth in Flip Chip Solder Joints,” Application of Fracture Mechanics in Electronic Packaging and Materials, 1995 ASME International Mechanical Engineering Congress and Exhibition, EEP-Vol. 11/MD-Vol. 64, pp. 231–236.

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