Modeling and calculation of slurry-chemistry effects on chemical–mechanical planarization with a grooved pad
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Mathematics
Link
http://link.springer.com/content/pdf/10.1007/s10665-008-9240-4.pdf
Reference28 articles.
1. Singh RK, Bajaj R (2002) Advances in chemical-mechanical planarization. MRS Bull 27: 743–747
2. Patrick WJ, Guthrie WL, Standley CL, Schiable PM (1991) Application of chemical mechanical polishing to the fabrication of VLSI circuit interconnections. J Electrochem Soc 138: 1778–1784
3. Singh RK, Lee S-M, Choi K-S, Basim GB, Choi W, Chen Z, Moudgil BM (2002) Fundamentals of slurry design for CMP of metal and dielectric materials. MRS Bull 27: 752–760
4. Moinpour M, Tregub A, Oehler A, Cadien K (2002) Advances in characterization of CMP consumables. MRS Bull 27: 766–771
5. Doy TK, Seshimo K, Suzuki K, Philipossian A, Kinoshita M (2004) Impact of novel pad groove designs on removal rate and uniformity of dielectric and copper CMP. J Electrochem Soc 151: G196–G199
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