Solderability assessment via sequential electrochemical reduction analysis
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrochemistry,General Chemical Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF00243325.pdf
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Organic Plating Additives Concentration on Carbon Content and Donor Density of Electroplated Tin;IOP Conference Series: Materials Science and Engineering;2019-05-01
2. Electrochemical dispersion method for the synthesis of SnO2 as anode material for lithium ion batteries;Journal of Applied Electrochemistry;2016-02-05
3. Removal of oxides from copper surface using femtosecond and nanosecond pulsed lasers;Applied Surface Science;2015-09
4. An Investigation into the Effect of a Post-electroplating Electrochemical Oxidation Treatment on Tin Whisker Formation;Journal of Electronic Materials;2014-09-18
5. Evaluation of the Oxide Thickness of Solder Bump via SERA and the Bondability of Solder Bump via Bump Fusion Test;Journal of The Japan Institute of Electronics Packaging;2014
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