Evaluation of the Oxide Thickness of Solder Bump via SERA and the Bondability of Solder Bump via Bump Fusion Test-Reference-Cited by-同舟云学术

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Evaluation of the Oxide Thickness of Solder Bump via SERA and the Bondability of Solder Bump via Bump Fusion Test

Published:2014 Issue:3 Volume:17 Page:189-197
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Ishikawa Shinji,Hashino Eiji,Kobayashi Takayuki,Tanaka Masamoto

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/17/3/17_189/_pdf

Reference15 articles.

1. 4) A. J. Bevolo: “Electron loss study of the native oxide of Tin,” J. Vac. Sci. Technol., Vol. 20, No. 4, pp. 943-945, 1982

2. 5) G. B. Hoflund: “Electron- Energy-Loss Study of the Oxidation of Polycrystalline Tin,” Physical Rev. B 46, pp. 7110-7120, 1992

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