Author:
Seo Changho,Ahn Daehwan,Kim Dongsik
Funder
NRF
Ministry of Trade, Industry and Energy
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference20 articles.
1. Multilevel interconnections for ULSI and GSI era;Murarka;Mater. Sci Eng.,1997
2. http://www-03.ibm.com/ibm/history/ibm100/us/en/icons/copperchip/.
3. Yield enhancement report and table from International Technology Roadmap for Semiconductors (ITRS), 2012 edition, http://www.itrs.net/Links/2012ITRS/Home2012.htm.
4. Solderability assessment via sequential electrochemical reduction anlaysis;Morgan Tench;J. Appl. Electrochem.,1994
5. The removal of copper oxides by ethyl alcohol monitored in situ by spectroscopic ellipsometry;Satta;J. Electrochem. Soc.,2003
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