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Reference21 articles.
1. Akiyama T, Briand D, Rooij NF (2011) Piezoresistive n-type 4H–SiC pressure sensor with membrane formed by mechanical milling. Proc IEEE Sens 222–225
2. Barlian AA, Park W-T, Mallon JR, Rasteger AJ, Beth LP (2009) Review: semiconductor piezoresistance for microsystems. IEEE Conf Proc 97(3):513–552
3. Dowling KM, Ransom EH, Senesky DG (2017) Profile evolution of high aspect ratio silicon sarbide trenches by inductive coupled plasma etching. J Microelectromech Syst 26:135–142
4. Eickhoffa M, Mollera H, Kroetza G, Bergb JV, et al (1999) A high temperature pressure sensor prepared by selective deposition of cubic silicon carbide on SOI substrates. Sens Actuators A 74:56–59
5. Hou SM-C (2003) Design fabrication of MEMS-array pressure sensor system for passive underwater navigation inspired by the lateral lines. Dissertation, Massachusetts Institute of Technology
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