Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder-Reference-Cited by-同舟云学术

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Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Published:2019-09-25 Issue:6 Volume:15 Page:693-701
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Lee Choong-Jae,Min Kyung Deuk,Park Hyun Joon,Kim Jae-Ha,Jung Seung-Boo

Funder

National Research Foundation of Korea

Ministry of Education

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s13391-019-00176-1.pdf

Reference41 articles.

1. Ma, D., Wu, P.: Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets. J. Alloys Compd. 671, 127–136 (2016)

2. Tu, K.N., Liu, Y.: Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology. Mater. Sci. Eng. R 136, 1–12 (2019)

3. Choudhury, S.F., Ladani, L.: Local shear stress–strain response of Sn–3.5Ag/Cu solder joint with high fraction of intermetallic compounds: experimental analysis. J. Alloys Compd. 680, 665–676 (2016)

4. Nazeri, M.F.M., Mohamad, A.A.: Corrosion resistance of ternary Sn–9Zn–xIn solder joint in alkaline solution. J. Alloys Compd. 661, 516–525 (2016)

5. Sun, H., Chan, Y.C., Wu, F.: Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints. J. Mater. Sci. Mater. Electron. 26, 5129–5134 (2015)

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1. Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints;Materials Today Communications;2024-08

2. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection;ACTA METALL SIN;2023

3. Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review;Crystals;2023-05-09

4. Effects of Nanoparticle Addition on the Reliability of Sn-Based Pb-Free Solder Joints Under Various Conditions: A Review;Nano;2023-01

5. Effect of Ni-Decorated Graphene Nanosheets On the Creep Behavior of Sn-3.0ag-0.5cu Solder Joints;2023

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