Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Annuar, S., Mahmoodian, R., Hamdi, M., Tu, K.-N.: Intermetallic compounds in 3D integrated circuits technology: a brief review. Sci. Technol. Adv. Mater. 18(1), 1–11 (2017)
2. Tu, K.N., Liu, Y., Li, M.: Effect of Joule heating and current crowding on electromigration in mobile technology. Appl. Phys. Rev. 4(1), 011101 (2017)
3. Chang, C.C., Lin, Y.W., Wang, Y.W., Kao, C.R.: The effects of solder volume and cu concentration on the consumption rate of Cu pad during reflow soldering. J. Alloys Compd. 492(1), 99–104 (2010)
4. Islam, M.N., Sharif, A., Chan, Y.C.: Effect of volume in interfacial reaction between eutectic Sn–3.5Ag–0.5Cu solder and Cu metallization in microelectronic packaging. J. Electron. Mater. 34(2), 143–149 (2005)
5. Liu, L., Huang, M.: Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and Cu pad. In: International Conference on Electronic Packaging Technology and High Density Packaging, pp. 299–304 (2010)
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献