Affiliation:
1. College of Mechanical and Control Engineering, Guilin University of Technology , Guilin , 541004, Guangxi , China
Abstract
AbstractAfter tin–lead solders are banned, the widely used electronic packaging interconnect materials are tin–silver, tin–copper, and other alloy solders. With the application of high-power devices, traditional solders can no longer meet the new requirements. Nano-silver (Ag) paste, as a new solder substitute, exhibits excellent properties, such as excellent thermal and electrical conductivity, sintering at lower temperatures, and service at high temperatures. However, many organic devices still cannot withstand this temperature, and are often not suitable for the connection of nano-Ag paste packaging materials, therefore, it is very urgent to further reduce the sintering temperature of nano-silver paste. Based on the transient liquid phase sintering technology, by doping the nano-Ag paste with the nano-tin paste with a lower melting point to make the two uniformly mix, pressureless sintering at low temperature can be realized, and a sintered joint with a connection strength greater than 20 MPa can be formed. Considering that tin is easy to be oxidized, and the core–shell material can prevent the oxidation of tin, and at the same time ensure the uniform distribution of tin in silver, the doping scheme of the core–shell structure is determined. Heterogeneous flocculation method refers to the particles with different properties of charges which attract each other and agglomerate. It is a continuous reduction method for preparing core–shell materials. This method has the advantages of mild reaction conditions and less equipment investment, so the heterogeneous flocculation method is selected to prepare Sn@Ag core–shell nano paste. And research its sintering performance and strengthening mechanism.
Subject
Condensed Matter Physics,General Materials Science
Reference37 articles.
1. Bai, J. G., J. N. Calata, and G. Q. Lu. Processing and characterization of nanosilver pastes for die-attaching SiC devices. Transaction on Electronics Packaging Manufacturing, Vol. 30, 2007, pp. 241–245.
2. Hwang, J. S. Solder technologies for electronic packaging and assembly. Electron Packag Interconnect Handb, Vol. 6, 2000, pp. 81–83.
3. Wong, C. P. Polymers in electronic packaging. Electronic Packaging and Interconnection Handbook, Vol. 1, 2000, pp. 1–21.
4. Suganuma, K. Lead-free soldering technology. Translated by Ning Xiaoshan, Science Press, Beijing, China, 2004, pp. 75–129.
5. Tu, K. N. Solder Joint Technology. Springer Science, Vol. 4, 2007, pp. 1–5.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献