Die Attachment by Extremely Fast Pressure-Assisted Sintering of 200 nm Cu Particles
Author:
Funder
SeoulTech
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s13391-021-00277-w.pdf
Reference24 articles.
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2. Liu, X., Nishikawa, H.: Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging. Scr. Mater. 120, 80–84 (2016)
3. Liu, J., Chen, H., Ji, H., Li, M.: Highly conductive Cu-Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticles. ACS Appl. Mater. Interf. 8, 33289–33298 (2016)
4. Zuo, Y., Shen, J., Xu, H., Gao, R.: Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints. Mater. Lett. 199, 13–16 (2017)
5. Gao, Y., Zhang, H., Li, W., Jiu, J., Nagao, S., Suganuma, T., Suganuma, K.: Die bonding performance using bimodal Cu particle paste under different sintering atmospheres. J. Electron. Mater. 46, 4575–4581 (2017)
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