Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference47 articles.
1. SiC die attach for high-temperature applications;Drevin-Bazin;J Electron Mater,2014
2. SiC power MOSFETs performance, robustness and technology maturity;Castellazzi;Microelectron Reliab,2016
3. Streaming transport of two dimensional electron gas in AlGaN/GaN/AlGaN double heterostructures;Liu;Superlattice Microst,2017
4. Prediction of IGBT power module remaining lifetime using the aging state approach;Li;Microelectron Reliab,2019
5. A survey of SiC power MOSFETs short-circuit robustness and failure mode analysis;Ceccarelli;Microelectron Reliab,2017
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fabrication of Cu Particles with Porous Surface and Enhanced Sinter-Bondability between Cu Finishes by Physically In Situ Formation of Cu Nanoparticles Using Them;Metals and Materials International;2024-09-09
2. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste;Journal of Materials Science: Materials in Electronics;2024-08
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