Author:
Chen Liangbiao,Jiang Tengfei,Fan Xuejun
Publisher
Springer International Publishing
Reference90 articles.
1. Z. Wang, J. Microelectromech. Syst. 24, 1211 (2015)
2. J.U. Knickerbocker et al., IBM J. Res. Dev. 52, 553 (2008)
3. P. Garrou, C. Bower, P. Ramm, Handbook of 3D Integration (Wiley-VCH, Germany, 2008)
4. M. Jung, J. Mitra, D.Z. Pan, S.K. Lim, Commun. ACM 57, 107 (2014)
5. JEDEC-JEP158, (JEDEC Solid State Technology Association, 2009)
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A novel 3D packaging technology for high-reliability applications;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05
4. Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems;Encyclopedia of Continuum Mechanics;2020
5. Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems;Encyclopedia of Continuum Mechanics;2019