Conclusions and Future Works
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-20385-0_6
Reference29 articles.
1. Yu, B., Gao, J.-R., Pan, D.Z.: Triple patterning lithography (TPL) layout decomposition using end-cutting. In: Proceedings of SPIE, vol. 8684 (2013)
2. Yu, B., Roy, S., Gao, J.-R., Pan, D.Z.: Triple patterning lithography layout decomposition using end-cutting. J. Micro/Nanolithogr. MEMS MOEMS (JM3) 14(1), 011002 (2015)
3. Kohira, Y., Matsui, T., Yokoyama, Y., Kodama, C., Takahashi, A., Nojima, S., Tanaka, S.: Fast mask assignment using positive semidefinite relaxation in LELECUT triple patterning lithography. In: IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), pp. 665–670 (2015)
4. Yu, B., Xu, X., Gao, J.-R., Pan, D.Z.: Methodology for standard cell compliance and detailed placement for triple patterning lithography. In: IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 349–356 (2013)
5. Yu, B., Xu, X., Gao, J.-R., Lin, Y., Li, Z., Alpert, C., Pan, D.Z.: Methodology for standard cell compliance and detailed placement for triple patterning lithography. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (TCAD) 34(5), 726–739 (2015)
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