Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes-Reference-Cited by-同舟云学术

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Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes

Published:2006-02 Issue:1 Volume:12 Page:75-80
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Choi Jae Woong,Hwang Gil Ho,Han Won Kyu,Kang Sung Goon

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF03027527.pdf

Reference11 articles.

1. S. Matsumoto,Electronic Display Devices, p. 140, Thomson Press, New Delhi (1990).

2. H. Uchiike, H. Lin, and M. Kamiya,IDW 95, p. 49, Institute of image information and Television Engineers (1995).

3. G. Sethi,Laser Focus World 34, 253 (1998).

4. A. A. Voronov, and V. P. Dedov,J. Opt. Technol. 66, 513 (1999).

5. D. Danovitch and H. Dang,Information Display 11, 26 (1995).

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2. Suppression of the thermal embrittlement induced by sulfur segregation to grain boundary in Ni-based electrodeposits;Materialia;2019-06

3. Effect of Hydrogen Plasma on Electroless-Plating Ni–B Films and Its Cu Diffusion Barrier Property;Journal of Nanoscience and Nanotechnology;2014-12-01

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5. Electroless Ni–B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package;Thin Solid Films;2009-01

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