Author:
Han Yin-He,Liu Cheng,Lu Hang,Li Wen-Bo,Zhang Lei,Li Xiao-Wei
Publisher
Springer Science and Business Media LLC
Subject
Computational Theory and Mathematics,Computer Science Applications,Hardware and Architecture,Theoretical Computer Science,Software
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Introduction;Built-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design;2023
2. Vertical traversal approach towards TSVs optimisation over multilayer network on chip (NoC);Microelectronics Journal;2021-10
3. Economizing TSV Resources in 3-D Network-on-Chip Design;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2015-03