A Low-Cost, Robust and Tolerant, Digital Scheme for Post-Bond Testing and Diagnosis of TSVs
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering
Link
https://link.springer.com/content/pdf/10.1007/s10836-021-05939-z.pdf
Reference24 articles.
1. Fang X, Yu Y, Peng X (2019) "TSV Prebond Test Method Based on Switched Capacitors," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 27(1):205–218
2. Hsu W, Kochte MA, Lee K (2017) Built-In Test and Diagnosis for TSVs With Different Placement Topologies and Crosstalk Impact Ranges. IEEE Trans Comput Aided Des Integr Circuits Syst 36(6):1004–1017
3. Huang Y, Pan C, Lin S, Guo M (2018) Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC. IEEE Transactions on Components, Packaging and Manufacturing Technology 8(4):699–706
4. "International Technology Roadmap for Semiconductors" (2013)
5. Jang J, Cheong M, Kang S (2019) TSV Repair Architecture for Clustered Faults. IEEE Trans Comput Aided Des Integr Circuits Syst 38(1):190–194
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