Substrate Testing on a Multi-Site/Multi-Probe ATE

Author:

Ma Xiaojun,Lombardi Fabrizio

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering

Reference30 articles.

1. Bhattacharya S, Chatterjee A (2005) Optimized wafer-probe and assembled package test design. ACM Transact Des Automat Electron Syst 10(2):303–329

2. Bruce RH, Meuli WP, Ho JM (1989) Multi chip modules. In: Proceedings of ACM/IEEE design automation conference, pp 389–393, June

3. Economikos L, Morrison T, Crnic F (1994) Electrical test of multichip substrates. IEEE Trans Compon Packaging Manuf Technol Part B: Advanced Packaging 17(1):56–61, February

4. Flying probe test systems: ATG test systems, http://www.atg-test-systems.de/products/products_f_lesstest.htm

5. Frye RC, Jui CL, Johnson MG (1994) Crosstalk noise in mixed-signal silicon-on silicon multichip modules. In: Proceedings of 1994 ISHM symposium & exhibition on microelectronics, November

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