Author:
Bruce R. H.,Meuli W. P.,Ho J.
Cited by
9 articles.
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1. Scaling the capacity of memory systems; evolution and key approaches;Proceedings of the International Symposium on Memory Systems;2019-09-30
2. Introduction;Testing of Interposer-Based 2.5D Integrated Circuits;2017
3. Built-In Self-Test and Test Scheduling for Interposer-Based 2.5D IC;ACM Transactions on Design Automation of Electronic Systems;2015-09-28
4. Electroplated Copper for Heterogeneous Die Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-07
5. Interconnect Testing and Test-Path Scheduling for Interposer-Based 2.5-D ICs;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2015-01