A Local Search Algorithm for Large-Scale MCM Substrate Testing
Author:
Affiliation:
1. Department of Industrial and Systems Engineering, Aoyama Gakuin University
Publisher
Japan Society of Mechanical Engineers
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Link
https://www.jstage.jst.go.jp/article/jamdsm/7/4/7_644/_pdf
Reference19 articles.
1. (1) D. Herrell, Multichip Module Technology at MCC, In Proceedings of IEEE International Symposium on Circuits and Systems, pp.2099-2103, 1990.
2. (2) Y. Zorian, Multi-chip Module Technology, In Proceedings of IEEE International Conference on Neural Networks, Vol.1, pp.152-157, 1995.
3. (3) R.H. Bruce and W.P. Meuli and H. Jackson, Multi Chip Modules, In Proceedings of ACM/IEEE Design Automation Conference, pp.386-393, 1989.
4. (4) S. Z. Yao and N. C. Chu and C. K. Cheng and T. C. Hu, A Multi-Probe Approach for MCM Substrate Testing, IEEE Transactions on Computer-Aided Design of Intergrated Circuits and Systems, Vol.13, pp.110-121, 1994
5. (5) N. C. Chu and C. K. Cheng and T. C. Russell, Dynamic Probe Scheduling Optimization for MCM Substrate Test, IEEE Transactions on Components, Packaging and Manufacturing Technology- Part B: Advanced Packaging, Vol.17, pp.182-189, 1994.
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