Author:
Kannan Sukeshwar,Kim Bruce,Ahn Byoungchul
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering
Reference27 articles.
1. Benabe E (1998) Automated characterization of ceramic multi-layer capacitors. In 52nd Advanced RF Techniques Group Conference, pp. 88–94
2. Bermond C, Cadix L, Farcy A, Lacrevaz T, Leduc P, Flechet B (2009) High frequency characterization and modeling of high density TSV in 3D integrated circuits. 13th Workshop on Signal Propagation on Interconnects
3. Chen H, Shih JY, Li SW, Lin HC, Wang MJ, Peng CN (2010) Electrical tests for three-dimensional ICs with TSVs. International Workshop on Testing Three-Dimensional Stacked Integrated Circuits
4. Chen PY, Wu CW, Kwai DM (2009) On-chip TSV testing for 3D IC before bonding using sense amplification. Proceedings of IEEE Asian Test Symposium
5. Friese M (1997) Multitone signal with low crest factor. IEEE Transactions on Communications 45(10)
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献