Author:
Huang R.,Yin H.,Liang J.,Sturm J. C.,Hobart K. D.,Suo Z.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Computational Mechanics
Reference44 articles.
1. Freund LB. The mechanics of electronic materials.Int J Solids Structures, 2000, 37(1–2): 185–196
2. Suo Z. Evolving material structures of small feature sizes.Int J Solids Structures, 2000, 37(1–2): 367–378
3. Gao H, Nix WD. Surface roughening of heteroepitaxial thin films.Ann Rev Mater Sci, 1999, 29: 173–209
4. Bruner K. Si/Ge nanostructures.Rep Porg Phys, 2002, 65(1): 27–72
5. Tong QY, Gosele U. Semiconductor Wafer Bonding: Science and Technology. New York: Wiley, 1998
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