Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems-Reference-Cited by-同舟云学术

Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems

Published:2021-12-07 Issue:4 Volume:18 Page:2105748
ISSN:1613-6810
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language:en
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Author:

Truong Thanh‐An¹,Nguyen Tuan‐Khoa¹,Zhao Hangbo²,Nguyen Nhat‐Khuong¹,Dinh Toan³,Park Yoonseok⁴,Nguyen Thanh³,Yamauchi Yusuke⁵,Nguyen Nam‐Trung¹,Phan Hoang‐Phuong¹^ORCID

Affiliation:

1. Queensland Micro and Nanotechnology Centre Griffith University, Nathan Queensland 4111 Australia

2. Department of Aerospace and Mechanical Engineering University of Southern California Los Angeles CA 90089 USA

3. Centre for Future Materials University of Southern Queensland Ipswich Queensland 4305 Australia

4. Querrey Simpson Institute for Bioelectronics Northwestern University Evanston IL 60208 USA

5. Australian Institute for Bioengineering and Nanotechnology The University of Queensland Brisbane Queensland 4072 Australia

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.202105748

Reference337 articles.

1. Channel cracking in thin films on substrates of finite thickness

2. Cracking of thin bonded films in residual tension

3. Stress‐Corrosion Cracking of Low‐Dielectric‐Constant Spin‐On‐Glass Thin Films

4. Mechanical behaviour of metallic thin films on polymeric substrates and the effect of ion beam assistance on crack propagation

5. Susceptibility of ternary aluminum alloys to cracking during solidification

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