Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation
Reference41 articles.
1. Device implications of strain relaxation in semiconductor microstructures;Akyuz,1999
2. Interface morphology development during stress corrosion cracking: Part 1. Via surface diffusion;Asaro;Met. Trans.,1972
3. Mechanical behavior of thin films;Bravman;MRS Bulletin,1992
Cited by
37 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献