Advances in Delamination Modeling

Author:

van der Sluis O.,Yuan C. A.,van Driel W. D.,Zhang G. Q.

Publisher

Springer US

Reference61 articles.

1. Zhang GQ, van Driel WD, Fan XJ (2006) Mechanics of Microelectronics. Springer, Berlin Heidelberg New York, ISBN 1-4020-4934-X

2. van Driel WD, Zhang GQ, Janssen JHJ, Ernst LJ, Su F, Chian KS, Yi S (2003) Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability 43:765–774

3. Zhang GQ (2003) The challenges of virtual prototyping and qualification for future microelectronics. Microelectronics Reliability 43:1777–1785

4. Ernst LJ, van Driel WD, van der Sluis O, Corigliano O, Tay AAO, Iwamoto N, Fan H, Yuen MMF (2006) Fracture and delamination in microelectronics. In: Proceedings of the Asian-Pacific conference for fracture and Strength (APCFS’06), Singapore

5. Kanninen MF, Popelar CH (1985) Advanced Fracture Mechanics. Oxford University Press, New York

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