Wire Boning Process Failure Risk Estimation of the Cu/low-k Structure using the Transient Finite Element
Author:
Affiliation:
1. Advanced Microsystem Packaging and Nano-Mechanics Research Lab,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966720.pdf?arnumber=9966720
Reference8 articles.
1. Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation
2. Molecular simulation on the material/interfacial strength of the low-dielectric materials
3. Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process;hsu;2007 International Conference on Electronic Materials and Packaging,2007
4. Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials
5. Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and equilibrium mesh smoothing algorithm
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