Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials-Reference-Cited by-同舟云学术

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Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

Published:2008-02-11 Issue:6 Volume:92 Page:061909
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Yuan Cadmus A.,van der Sluis Olaf,Zhang G. Q.,Ernst Leo J.,van Driel Willem D.,Flower Amy E.,van Silfhout Richard B. R.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2832639

Reference16 articles.

1. Mechanical characterization of low-k and barrier dielectric thin films

2. Interstitial O in Si and its interactions with H

3. The Effect of Plasma Damage on the Material Composition and Electrical Performance of Different Generations of SiOC(H) Low k Films

4. Challenges in the implementation of low-k dielectrics in the back-end of line

5. Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation

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1. Wire Boning Process Failure Risk Estimation of the Cu/low-k Structure using the Transient Finite Element;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

2. Evidence of Plasticity‐Driven Conductivity Drop in an Ultra‐Low‐k Dielectric Organosilicate Glass;Advanced Functional Materials;2022-09-11

3. Micromechanical simulation of the pore size effect on the structural stability of brittle porous materials with bicontinuous morphology;Physical Chemistry Chemical Physics;2019

4. Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects;Nanopackaging;2018

5. Mechanical Stability of Porous Low-k Dielectrics;ECS Journal of Solid State Science and Technology;2014-10-21

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