Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments
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Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-0-387-48433-4_15.pdf
Reference47 articles.
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5. W.J. Plumbridge, Solder. Surf. Mt. Technol. 11(3), 8 (1999)
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1. Electrical conductivity changes of bulk tin and Sn-3.0Ag-0.5Cu in bulk and in joints during isothermal aging;International Journal of Minerals, Metallurgy, and Materials;2010-07-28
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