Materials behaviour and the reliability in performance of solder joints-Reference-Cited by-同舟云学术

Materials behaviour and the reliability in performance of solder joints

Published:1999-12 Issue:3 Volume:11 Page:8-11
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Plumbridge W.J.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference3 articles.

1. THE IMPORTANCE OF FAILURE MODE IN FATIGUE?CREEP INTERACTIONS

2. Holloman, J.H. (1945), Trans Am, Inst, Mining Metallurgical and Petroleum Engrs, pp. 162‐8.

3. Plumbridge, W.J. (1999), “Fatigue‐creep interactions in a eutectic lead‐tin solder alloy”, in Benyon, J.H., Brown, M.W., Lindley, T.C., Smith, R.A. and Tomkins, B. (Eds), Engineering Against Fatigue, invited paper presented at the Conference on Engineering Against Fatigue, Sheffield, Balkema, Rotterdam, pp. 539‐45.

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