Electrical conductivity changes of bulk tin and Sn-3.0Ag-0.5Cu in bulk and in joints during isothermal aging

Author:

Liu Bin,Guo Fu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Geochemistry and Petrology,Mechanical Engineering,Mechanics of Materials

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Electrical diagnostics of passive components failure during reliability testing;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

2. Flame synthesis of mixed tin-silver-copper nanopowders and conductive coatings;AIChE Journal;2015-12-28

3. Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints;International Journal of Minerals, Metallurgy, and Materials;2014-01

4. Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints;International Journal of Minerals, Metallurgy, and Materials;2013-09

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