Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints-Reference-Cited by-同舟云学术

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Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

Published:2013-09 Issue:9 Volume:20 Page:883-889
ISSN:1674-4799
Container-title:International Journal of Minerals, Metallurgy, and Materials
language:en
Short-container-title:Int J Miner Metall Mater

Author:

Wei Guo-qiang,Wang Lei,Peng Xin-qiang,Xue Ming-yang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Geochemistry and Petrology,Mechanical Engineering,Mechanics of Materials

Link

http://link.springer.com/content/pdf/10.1007/s12613-013-0810-8.pdf

Reference19 articles.

1. C.M. Miller, I.E. Anderson, and J.F. Smith, A viable tinlead solder substitute: Sn-Ag-Cu, J. Electron. Mater., 23(1994), No. 7, p. 595.

2. M.O. Alam, Y.C. Chan, and K.N. Tu, Effect of 0.5 wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization, J. Appl. Phys., 94(2003), No. 12, p. 7904.

3. B. Liu and F. Guo, Electrical conductivity changes of bulk tin and Sn-3.0Ag-0.5Cu in bulk and in joints during isothermal aging, Int. J. Miner. Metall. Mater., 17(2010), No. 4, p. 453.

4. H.W. Chiang, K. Chang, and J.Y. Chen, The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu leadfree solder, J. Electron. Mater., 35(2006), No. 12, p. 2074.

5. K.S. Kim, S.H. Huh, and K. Suganuma, Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys, Mater. Sci. Eng. A, 333(2002), No. 1–2, p. 106.

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