Interfacial reaction issues for lead-free electronic solders-Reference-Cited by-同舟云学术

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Interfacial reaction issues for lead-free electronic solders

Published: Issue: Volume: Page:155-174
ISSN:
Container-title:Lead-Free Electronic Solders
language:
Short-container-title:

Author:

Ho C. E.,Yang S. C.,Kao C. R.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-0-387-48433-4_10.pdf

Reference120 articles.

1. A. Rahn (ed.), in The Basics of Soldering (John Wiely & Sons, New York, 1993)

2. J.H. Lau (ed.), in Flip Chip Technology (McGraw Hill, New York, 1996)

3. K.N. Tu, K. Zeng, Mater. Sci. Eng. R34, 1 (2001)

4. W.G. Bader, Weld. J. Res. Suppl. 28, 551s (1969)

5. C.J. Thwaites, Electroplat. Met. Finish. 26, 10 (1973)

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