Effects of PCB thickness on adjustable fountain wave soldering
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/s12046-015-0409-z.pdf
Reference23 articles.
1. Abdul Aziz M S, Abdullah M Z, Khor C Y and Che Ani F 2013 Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach. Int. Commun. Heat Mass Transfer 48: 116– 123
2. Abdul Aziz M S, Abdullah M Z and Khor C Y 2014a Influence of PTH offset angle in wave soldering with thermal-coupling method. Soldering Surface Mount Technol. 26 (3): 97–109
3. Abdul Aziz M S, Abdullah M Z, Khor C Y, Fairuz Z M, Iqbal A M, Mazlan M and Mat Rasat M S 2014b Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering. Adv. Mech. Eng. 2014: 1–13
4. Abdul Aziz M S, Abdullah M Z, Khor C Y, Jalar A and Che Ani F 2014c CFD modeling of pin shape effects on capillary flow during wave soldering. Int. J. Heat Mass Transfer 72: 400–410
5. Alpha 2011 Wave soldering troubleshooting guide. Cookson Electronics, 10/11 SM1071, 1–20. www.alpha.cooksonelectronics.com
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