Forming of advanced THT-interconnects using SB2 laser solder jetting process
Author:
Affiliation:
1. PacTech - Packaging Technologies,Nauen,Germany,14641
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195764.pdf?arnumber=10195764
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1. Formation and growth of intermetallics evolution at the SAC305 and SAC0307 solder joints after wave soldering
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4. Effect of Contact Time on Lead Free Wave Sodering;morris;Speedline Technologies Inc,2008
5. IPC-A-610-G;Acceptability of Electronic Assemblies Through-Hole Technology,2017
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