Heterogeneous 3D Nano-systems: The N3XT Approach?-Reference-Cited by-同舟云学术

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Heterogeneous 3D Nano-systems: The N3XT Approach?

Published:2020 Issue: Volume: Page:127-151
ISSN:1612-3018
Container-title:The Frontiers Collection
language:
Short-container-title:

Author:

Rich Dennis,Bartolo Andrew,Gilardo Carlo,Le Binh,Li Haitong,Park Rebecca,Radway Robert M.,Sabry Aly Mohamed M.,Wong H.-S. Philip,Mitra Subhasish

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-030-18338-7_9

Reference98 articles.

1. M.M.S. Aly, T.F. Wu, A. Bartolo, Y.H. Malviya, W. Hwang, G. Hills, I. Markov, M. Wootters, M.M. Shulaker, H.-P. Wong, S. Mitra, The N3XT approach to energy-efficient abundant-data computing. Proc. IEEE 107, 19–48 (2019). https://doi.org/10.1109/JPROC.2018.2882603

2. P. Wong, What will the next node offer us? in Hot Chips (2019). https://www.hotchips.org/hc31-keynotes-available-to-all/

3. M.M.S. Aly, M. Gao, G. Hills, C. Lee, G. Pitner, M.M. Shulaker, T.F. Wu, M. Asheghi, J. Bokor, F. Franchetti, K.E. Goodson, C. Kozyrakis, I. Markov, K. Olukotun, L. Pileggi, E. Pop, J. Rabaey, C. Ré, H.-P. Wong, S. Mitra, Energy-efficient abundant-data computing: the N3XT 1,000x. Computer 48, 24–33 (2015). https://doi.org/10.1109/MC.2015.376

4. S. Van Huylenbroeck, M. Stucchi, Y. Li, J. Slabbekoorn, N. Tutunjyan, S. Sardo, N. Jourdan, L. Bogaerts, F. Beirnaert, G. Beyer et al., Small pitch, high aspect ratio via-last TSV module, in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (IEEE, 2016), pp. 43–49

5. S.-W. Kim, M. Detalle, L. Peng, P. Nolmans, N. Heylen, D. Velenis, A. Miller, G. Beyer, E. Beyne, Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process, in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (IEEE, 2016), pp. 1179–1185

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