Scanning electron microscopy of epoxy-glass laminates exposed to humid conditions-Reference-Cited by-同舟云学术

Scanning electron microscopy of epoxy-glass laminates exposed to humid conditions

Published:1985-06 Issue:6 Volume:20 Page:2038-2044
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Kasturiarachchi K. A.,Pritchard G.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01112287.pdf

Reference13 articles.

1. B. Dewimille, J. Thoris, R. Mailfert andA. R. Brunsell, ?Advances in Composite Materials?, Vol. 1, edited by A. R. Bunsell, (Pergamon Press, Oxford, 1980) p. 597.

2. O. Ishai andU. Arnon,J. Test. Eval. 5 (1977) 320.

3. G. Marom andL. J. Broutman,Polym. Compos. 2 (1981) 132.

4. C. E. Browning,Polym. Eng. Sci. 18 (1978) 1, 16.

5. R. W. Lauver, 33rd Annual Technical Conference, Reinforced Plastics/Composites Institute, SPI, Paper 15-C, Washington, D.C., USA (Society of the Plastics Industries, New York, 1978).

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly;Journal of Materials Science: Materials in Electronics;2019-02-12

2. Environmental aging of epoxy based stereolithography Part 2 – Effect of absorbed moisture on mechanical properties;Plastics, Rubber and Composites;2012-04

3. Modelling the effect of moisture on the depth sensing indentation response of a stereolithography polymer;Computational Materials Science;2012-02

4. Investigation of the effect of relative humidity on polymers by depth sensing indentation;Journal of Materials Science;2011-07-09

5. Recent advances in isotropic conductive adhesives for electronics packaging applications;International Journal of Adhesion and Adhesives;2008-10