Funder
Ministry of Education
Korea Institute of Energy Technology Evaluation and Planning
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Yoshida, J. Taniguchi, K. Murata, M. Kada, Y. Yamamoto, Y. Takagi, T. Notomi, A. Fujita, A study on package stacking process for packge-on-packge (PoP). In Proceedings of the electronic components and technology conference (ECTC) (2006)
2. J.W. Kim, Y.C. Lee, S.S. Ha, S.B. Jung, J. Mater. Sci.-Mater. Electron. 20, 17 (2009)
3. W. Lin, M.W. Lee, PoP/CSP warpage evaluation and viscoelastic modeling. In Proceedings of the electronic components and technology conference (ECTC) (2008)
4. D Chang, Y.P. Wang, C.S. Hsiao, Warpage and stress characteristic analyses on packag-on-package (PoP) structure. In Proceedings of the electronics packaging technology conference (ECTC) (2007)
5. F.X. Che, D. Ho, M.Z. Ding, X. Zhang, Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology. In Proceedings of the electronics packaging technology conference (EPTC), (2015)
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