Funder
Ministry of Science and Technology, Taiwan
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference38 articles.
1. N. Jiang, L. Zhang, Z.-Q. Liu, L. Sun, W.-M. Long, P. He, M.-Y. Xiong, M. Zhao, Reliability issues of lead-free solder joints in electronic devices. Sci. Technol. Adv. Mater. 20, 876–901 (2019)
2. W. Liu, S. Bai, Thermoelectric interface materials: a perspective to the challenge of thermoelectric power generation module. J. Materiomics 5, 321–336 (2019)
3. C.E. Ho, S.Y. Yang, C.R. Kao, Interfacial reactions issues for lead-free electronic solders. J. Mater. Sci.: Mater. Electron. 18, 155–174 (2007)
4. M.-Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)
5. T. Laurila, V. Vuorinen, J.K. Kivilahti, Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng. R 49, 1–60 (2005)
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