Funder
National Natural Science Foundation of China
Natural Science Foundation of Hubei Province
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Q. Zhang, H. Zou, Z. Zhang, Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate. J. Mater. Res. 25(2), 303–314 (2010)
2. X. Zhao, M. Saka, M. Muraoka et al., Electromigration behaviors and effects of addition elements on the formation of a Bi-rich layer in Sn58Bi-based solders. J. Electron. Mater. 43(11), 4179–4185 (2014)
3. M. Lu, D.Y. Shih, P. Lauro et al., Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders. Appl. Phys. Lett. 92(21), 1335 (2008)
4. K. Lee, K.S. Kim, Y. Tsukada et al., Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints. J. Mater. Res. 114(3), 467–474 (2011)
5. W. Yue, H. Qin, M. Zhou et al., Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing. Trans. Nonferrous Met. Soc. China 24(5), 1619–1628 (2014)
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献