Growth Mechanisms of Intermetallic Compounds and Bi-Rich Layer in Ball Grid Array Structure Cu/Sn-58Bi/Cu Solder Joints During Solid-Solid and Liquid-Solid Electromigration
Author:
Publisher
Elsevier BV
Subject
General Earth and Planetary Sciences,General Environmental Science
Reference33 articles.
1. Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions;J A Depiver;Eeg. Fail. Aanl,2021
2. Effects of Ag addition and Ag 3 Sn formation on the mechanical reliability of Ni/Sn solder joints;K M Chu;Microelectron. Reliab,2017
3. Interfacial evolution in Sn-58Bi solder joints during liquid electromigration;F J Wang;J. Mater. Sci. Mater. Electron,2018
4. Analysis of the BGA solder Sn-3.0Ag-0.5Cu crack interface and a prediction of the fatigue life under tensile stress;Y L Chen;Int. J. Fatigue,2016
5. Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging;Y Ma;Mater. Sci. Eng. A,2017
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