1. H.H. Radamson, Y. Zhang, X. He, H. Cui, J. Li, J. Xiang, J. Liu, S. Gu, G. Wang, The challenges of advanced CMOS process from 2D to 3D. Appl. Sci. 7(10), 1047 (2017)
2. H.H. Radamson, X. He, Q. Zhang, J. Liu, H. Cui, J. Xiang, Z. Kong, W. Xiong, J. Li, J. Gao, H. Yang, S. Gu, X. Zhao, Y. Du, J. Yu, G. Wang, Miniat. CMOS 10(5), 293 (2019)
3. H.H. Radamson, J. Luo, E. Simeon, Z. Chao, Past, Present and Future of CMOS (Elsevier, Duxford, 2018), p. 2018
4. H.H. Radamson, L. Thylen, Monolithic Nanoscale Photonics-Electronics Integration in Silicon and Other Group 1 V Elements (Elsevier, Burlington, 2014)
5. G. Wang, A. Abedin, M. Moeen, M. Kolahdouz, J. Luo, Y. Guo, T. Chen, H. Yin, H. Zhu, J. Li, C. Zhao, H.H. Radamson, Integration of highly-strained SiGe materials in 14 nm and beyond nodes FinFET technology. Solid State Electron. 103, 222–228 (2015)