Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP-Reference-Cited by-同舟云学术

Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP

Author:

Yang Li^ORCID,Xu Yuhang,Zhang Yaocheng,Lu Kaijian,Qiao Jian,Yang Yao,Xu Feng,Gao Huiming

Funder

National Natural Science Foundation of China

Natural Science Foundation of the Jiangsu Higher Education Institutions of China

Guangxi Natural Science Foundation Project

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

Reference31 articles.

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2. W. Zhou, X. Zhong, K. Sheng, I.E.E.E.T. Power, Electr. 29, 2329 (2014)

3. R. Wang, D. Boroyevich, P. Ning, Z. Wang, F. Wang, P. Mattavelli, K.D.T. Ngo, K. Rajashekara, I.E.E.E.T. Power, Electr. 28, 555 (2013)

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