Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Z.L. Li, L.X. Cheng, G.Y. Li, J.H. Huang, Y. Tang, Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints. J. Alloy. Compd. 697, 104 (2017)
2. A. Sharma, S. Kumar, D. Jung, J.P. Jung, Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders. J. Mater. Sci.: Mater. Electron. 28, 8116 (2017)
3. W. Sabbah, P. Bondue, O. Avino-Salvado, C. Buttay, H. Frémont, A. Guédon-Gracia, H. Morel, High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectron. Reliab. 76, 362 (2017)
4. V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: a review. IEEE Trans. Components, Packaging Manuf. Technol. 1, 457 (2011)
5. H.S. Chin, K.Y. Cheong, A.B. Ismail, A review on die attach materials for SiC-based high-temperature power devices. Metall. Mater. Trans. B 41, 824 (2010)
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献