Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. S. Jahdi, O. Alatise, J.A. Ortiz Gonzalez, R. Bonyadi, L. Ran, and P. Mawby, Temperature and switching rate dependence of crosstalk in Si-IGBT and SiC power modules. IEEE Trans. Ind. Electron. 63(2), 849–863 (2016).
2. L. Zhang, X. Yuan, X. Wu, C. Shi, J. Zhang, and Y. Zhang, Performance evaluation of high-power SiC MOSFET modules in comparison to Si IGBT modules. IEEE Trans. Power Electron. 34(2), 1181–1196 (2019).
3. E. Lon, Bell, cooling, heating, generating power, and recovering waste heat with thermoelectric systems. Science 321, 1457–1461 (2008).
4. J. Broughton, V. Smet, R.R. Tummala, and Y.K. Joshi, Review of thermal packaging technologies for automotive power electronics for traction purposes. ASME J. Electron. Packag. 140(4), 040801 (2018).
5. M.C. Shaw, J.R. Waldrop, S. Chandrasekaran, B. Kagalwala, X. Jing, E.R. Brown, V.J. Dhir, M. Fabbeo, Enhanced thermal management by direct water spray of high-voltage, high power devices in a three-phase, 18-hp AC motor drive demonstration, in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No. 02CH37258). IEEE, pp. 1007–1014 (2002)