Diffusion induced residual stress in comb-type microaccelerometer structure-Reference-Cited by-同舟云学术

Diffusion induced residual stress in comb-type microaccelerometer structure

Published:2014-06-21 Issue:9 Volume:25 Page:3828-3832
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Dutta Shankar,Shaveta ,Imran Md.,Pal Ramjay,Bhan R. K.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-014-2095-8.pdf

Reference18 articles.

1. M.J. Madau, Fundamental of Microfabrication: The Science of Miniaturization (CRC Press, Boca Raton, 2002)

2. R.B. Fair, A.F.W. Willoughby, Impurity doping processes in silicon, in Materials and Processing Theory and Practices, Chap. 7, vol. 2, ed. by F.F.Y. Wang (North Holland, Amsterdam, 1981)

3. H.J. De Los Santos, Introduction to Microelectromechanical (MEMS) Microwave Systems, Chaps. 1 and 2, 2nd edn. (Artech House, London, 2004)

4. K. Najafi, K. Suzuki, Thin Solid Films 181, 251 (1989)

5. K.D. Wise, K. Najafi, Science 254, 1335 (1991)

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