Funder
National Natural Science Foundation of China
Natural Science Foundation of Jiangxi Province
Outstanding Young talents funding of Jiangxi Province
State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference42 articles.
1. H. Wang, X. Hu, X. Jiang, Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-30Ag-05Cu composite solder joints. Mater. Charact. 163, 110287 (2020)
2. X. Hu, H. Xu, W. Chen, X. Jiang, Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints. J. Manuf. Process. 64, 648–654 (2021)
3. J. Wang, J. Chen,Z. Zhang, P. Zhang, Z. Yu, S. Zhang, Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints. Solder. Surface Mount Technol.
4. H. Wang, X. Hu, X. Jiang, Y. Li, Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux. J. Manuf. Process. 62, 291–301 (2021)
5. J. Sasaki, M. Itoh, T. Tamanuki, H. Hatakeyama, Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps. IEEE Trans. Adv. Packag. 24, 569–575 (2001)
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