Mechanical testing and characterization of tin–zinc–antimony–lanthanum lead-free solders produced using mechanical alloying and furnace melting techniques

Author:

D. Arthur Jebastine Sunderraj,D. Ananthapadmanaban,Kathiresan Arun Vasantha Geethan

Abstract

Purpose The purpose of this paper is to investigate the effects of two different weight percentages of lanthanum on tin–zinc–antimony solder alloys. Two manufacturing techniques were used: the furnace melting method (FMM) and ball milling method (BMM). The alloys were characterized and mechanically tested. Design/methodology/approach Tin–zinc–antimony alloys with 0.5 and 1% lanthanum were prepared by FMM and BMM for 25, 30 and 35 h. The tensile, shear, hardness, wear and corrosion properties were characterized using optical microscopy, scanning electron microscopy and X-ray diffraction. Findings Ball-milled samples were harder and more resistant to wear than furnace-melted samples. Corrosion tests showed that ball-milled samples of both the 0.5 and 1% lanthanum tin-based solders showed higher corrosion than furnace-melted samples. The ball-milled samples exhibited a uniform particle distribution. The ductility of the milled samples was significantly higher than that of the furnace-melted ones. There was strong evidence of the presence of nanoparticles. X-ray diffraction revealed some amorphous phases, which have not been previously reported. Originality/value The quality of solder alloys prepared by FMM and BMM was compared. This comparison was not made in previous studies. In addition to the hardness, the wear and corrosion resistances were measured, which have not been previously reported. There seems to be evidence of the presence of nanoparticles in the solder, as suggested by the increase in the elongation. Tensile, elongation and shear tests were performed, and a theory was provided for the results obtained.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

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