Machining damage of monocrystalline silicon by specific crystallographic plane cutting of wire electrical discharge machining

Author:

Ge Mengxing,Liu Zhidong,Chen Haoran,Shen Lida,Qiu Mingbo,Tian Zongjun

Funder

National Natural Science Foundation of China

The Fundamental Research Funds for the Central Universities

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. M.A. Chun, Development trend of semiconducting silicon materials of the world. Shanghai Nonferrous Met. 26(3), 145–148 (2005)

2. M.W. Johnson, S. Manolopoulos, N.J. Rhodes et al., Silicon APS detectors for neutron scattering. Nucl. Instrum. Methods Phys. Res. Sect. A 501, 72–79 (2003)

3. J. Słowik, A. Zięba, Silicon strip detector applied to X-ray diffractometer: angular resolution and counting rate. Nucl. Instrum. Methods Phys. Res. 551(1), 73–77 (2005)

4. Y. Wang, J. Kang, Development and challenges of lithography for ULSI. Chin. J. Semicond 3, 225–237 (2002)

5. Q. Zhang, H. Zhou, D. Li, Indention microcrack formation and propagation in single crystalline silicon at room temperature. J. Chin. Electron Microsc. Soc 21(1), 56–58 (2002)

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