Electromigration in reduced-height solder joints with Cu pillars-Reference-Cited by-同舟云学术

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Electromigration in reduced-height solder joints with Cu pillars

Published:2015-12-17 Issue:4 Volume:27 Page:3715-3722
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Chen Ming-Yao,Liang Y. C.,Chen Chih

Funder

Ministry of Science and Technology of Taiwan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-015-4213-7.pdf

Reference26 articles.

1. G.T. Lim et al., Temperature effect on intermetallic compound growth kinetics of Cu pillar/Sn bumps. J. Eelctron. Mater 38, 2228 (2009)

2. Y.C. Liang et al., Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints. J. Appl. Phys. 111, 043705 (2012)

3. Ann A. Liu et al., Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films. J. Appl. Phys. 80, 2774 (1996)

4. S.W. Liang et al., Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing. J. Electron. Mater. 36, 159 (2007)

5. J.W. Nah et al., Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization. J. Mater. Res. 22, 763 (2007)

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