Author:
Suhir E.,Ghaffarian R.,Yi S.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference57 articles.
1. J. Lau (ed.), Solder Joint Reliability: Theory and Applications (Van Nostrand Reinhold, New York, 1990)
2. J.-P. Clech, F. M. Langerman, J. A. Augis, Local CTE mismatch in SM leaded packages: a potential reliability concern, in Proceedings on 40th Electronic Components and Technology Conference, Las Vegas, NE (1990)
3. W. Engelmaier, Reliability for surface mount solder joints: physics and statistics of failure, in Proceedings on Surface Mount International, vol. 1 (San Jose, CA, 1992)
4. H.D. Solomon, Fatigue of 60/40 solder. IEEE CHMT Trans. 9(4), 423–432 (1986)
5. H.U. Akay, N.H. Paydar, A. Bilgic, Fatigue life prediction for thermally loaded solder joints using a volume-weighted averaging technique. ASME J. Electron. Packag. 119, 228–235 (1997)
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